The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

It can be easy to take the humble terminal block for granted. Like the steel girder on a bridge, terminal blocks provide necessary structure and stability within the electrical panel. But once they’re ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Designing custom assemblies is essential to advancing bioprocessing, yet teams often face slow design cycles, limited flexibility and communication gaps between users and suppliers. These challenges ...

The different types of PCB assembly methods like surface mount, through-hole, and mixed assembly. How these PCB assembly processes differ from each other. The performance of a printed circuit board ...