Memory cards and SSDs are devices we rely on and expect to function flawlessly. At CES, Lexar will be launching new memory products and will unveil its AI Storage Core.

Micron Technology, Inc. announced its integration of the HBM3E 36GB 12-high memory product into AMD's upcoming Instinct™ MI350 Series solutions, emphasizing both power efficiency and performance essential for training large AI models and managing complex ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM.

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and up to a 2X better on AI inference workloads in ...

[Luizão] wanted to create some hardware to honour the memory of the technology used to put man on the moon and chose the literal core of the project, that of the hardware used to store the software that provided the guidance. We’re talking about the ...

Compute Express Link (CXL), the technology for connecting memory, was among the themes at last week’s Future of Memory and Storage summit in Santa Clara. CXL is an open standard for high-speed, processor-to-device and processor-to-memory connections.

Scientists have developed a groundbreaking on-chip quantum memory platform using 3D-nanoprinted hollow-core waveguides called "light cages" to store flying photons in cesium vapor. This innovative approach achieves storage times of several hundred nanoseconds while enabling multiple quantum memories on a single chip.

Flash-memory manufacturing technologies are critical to microcontroller (MCU) design. Renesas has become the first in the industry to develop a 40-nm generation production process for MCU-internet flash memory. By jumping directly from today’s 90-nm ...