Panasonic Corporation announced today that it has commercialized the first sulfur-free *2 encapsulation molding compound (EMC) for copper wire bonding in the industry *1, and will start mass ...

SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...