SAN JOSE, Calif. &#151 Following possible shortages and supply-chain disruptions in the market, Japan's Shin-Etsu Chemical Co. Ltd. (SEH) has recently increased the prices for its epoxy molding ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and ...

Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Some ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Bulk molding compound (BMC) is a ready-to-mold, glass-fiber reinforced thermoset polymer material used in compression molding, along with injection molding and transfer molding. BMC is manufactured by ...

Engineered structural composites (ESC) combine fiberglass or carbon fiber with polyester, vinyl ester, polyurethane, and epoxy resins. They resist corrosion, extreme temperatures, moisture, and ...

IACMI Project 3.2 evaluated carbon fiber-reinforced composites infused with a novel epoxy-based resin system to develop structural composite parts with complex geometry to replace metals in ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...