New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Abstract: As a result of recent onshoring efforts, Printed Circuit Board (PCB) and Integrated Circuit Substrate (ICS) Fabrication is a fast-growing industry in the United States. At the leading edge ...

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...

Taiwan's PCB equipment suppliers are optimistic that IC substrate process facilities requiring ever-higher equipment cleanliness and procession will become their major growth driver in the next decade ...

Driven by growing demand for 5G handset applications, China-based PCB makers are keenly expanding capacity for HDI and substrate-like PCB (SLP) products and IC substrates, according... IC substrates ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D WILMINGTON, Mass.--(BUSINESS WIRE)--Onto ...

As artificial intelligence (AI) becomes more widely used, an industry sector that is also heating up is glass substrates. Major domestic component companies are entering the commercialization of glass ...

The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...