Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...

Intel stock’s (NASDAQ:INTC) foundry business faces a moment of truth in 2025, as it looks to commercialize its cutting-edge 18A process – widely seen as a make-or-break semiconductor fabrication ...

Intel’s 18A is now shipping with gate-all-around and backside power delivery, marking a transition to commercial execution.

Intel's management revealed during the company's Q3 2025 earnings call that while its 18A fabrication process is progressing predictably, with usable yields, enabling the company to begin ramping ...

TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...

Intel's 18A process node is ready for customer projects, promising 15% better performance per watt and 30% better chip density than Intel 3. Intel's Xeon 6 processors have been adopted by major ...

Despite a long list of issues plaguing chip giant Intel (NASDAQ: INTC), the company has made meaningful progress catching up to TSMC in semiconductor manufacturing. Intel was stuck on its heavily ...

TL;DR: Intel's new Arizona facility is testing 18A (1.8nm-class) wafers, marking a significant milestone for U.S. manufacturing. Kevin O'Buckley, Senior VP of Foundry Services, explains that "risk ...

Intel’s upcoming 18A process has reportedly failed tests with chipmaker Broadcom. Citing three sources with knowledge of the matter, Reuters reported that after receiving silicon wafers back from ...