Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Traditional IC pattern-generation methods focus on detectingdefects at gate terminals or at interconnects. Unfortunately, a significantpopulation of defects may occur within an IC's gates, or cells.

ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.

Once IC fabrication is complete, engineers use fault models to create test patterns that detect defects. These fault models are typically abstractions of defect behavior based on our experience and ...