During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
Sponsored by Vitrek, LLCReviewed by Maria OsipovaOct 9 2025 The wafer lapping process is key to effective semiconductor thinning. It requires extremely tight control to avoid over-removal of material ...
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