Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...
BUFFALO, N.Y. -- Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the University at Buffalo ...
The benefits of hardware prototyping. Advantages of having custom-designed prototypes. Packaging considerations to make when prototyping. Benchtop tools available for in-lab prototype assembly. The ...
Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback