Semiconductor Engineering

Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding

A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...
Semiconductor Engineering

Thermal, Mechanical, And Material Stresses Grow With Die Stacking

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...
Design And Reuse

Visualizing Cross-Die Paths in Multi-Die Designs

Developing a multi-die design introduces numerous additional steps and challenges from architectural specification through logical and physical design to verification and signoff. Designing in three ...
Electronic Design

Multi-Die Solution to Empower DFT for Stackable Chip-Scale Architectures

The pressure to increase chip density has caused designers to leapfrog Moore’s Law and leverage other technologies beyond sheer feature size to address it. Since Gordon E. Moore, co-founder of Intel, ...
Seeking Alpha

Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP ...
Electronic Design

Why 2023 Holds Big Promise for Multi-Die Systems

Explore insights into the accelerated shift toward multi-die systems in 2023. How different parts of the multi-die systems ecosystem are evolving. The adoption of muti-die architectures in various ...