As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...
As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (AMAT) today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance ...
SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...
Applied is working with all leading-edge logic chipmakers on a growing number of applications for its Sculpta ® pattern-shaping technology Introducing innovative new etch systems, CVD patterning films ...
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