Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Kaynes has also forged a significant partnership with global industrial software giant Siemens to enhance its system and package design capabilities, Panicker added. Under the collaboration, Kaynes ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's ...