"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB Size Min: 55*55mm – Max: 400*350mm ...
One of the major changes to affect automatic optical inspection (AOI) equipment used during PCB assembly and inspection is the greatly reduced size of the latest components. As stated in an October ...
Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor ...
Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...
As inspection has evolved from an end-of-line procedure into an integral part of many production lines, inspection technology itself has also evolved. Stacy Kalisz Johnson, market development manager ...
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