Hanmi Semiconductor arrives at SEMICON West 2026 in San Francisco with its full HBM4 bonding suite and a next-generation Wide TC Bonder preview, underscoring the South Korean firm's approximately 90 ...

Samsung Electronics plans to complete the development of its advanced packaging technology, 3D Cube-H, by early 2027, along ...

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks... Some subscribers prefer to ...

A man walks past the logo of Samsung Electronics displayed at the company's Seocho building in Seoul on April 7, 2026. Jung Yeon-je/AFP via Getty Images Samsung Electronics has put hard numbers behind ...

Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South Korean equipment ...

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric ...

Copper–copper direct bonding has emerged as a cornerstone of three-dimensional (3D) integration, enabling the vertical stacking of semiconductor dies with minimal electrical resistance and high ...