The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...
Micron breaks ground on a new advanced NAND wafer fab in Singapore, backing AI-driven demand with a $24bn long-term investment.
Synthetic diamond, thanks to its superlative properties, including high breakdown field and high thermal conductivity, is the ultimate answer, promising to become the go-to material platform for the ...
PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
The 2nm wafer technology ramp-up can potentially accelerate revenues and gross margins even more than what was seen in the 3nm ramp-up. TSMC is capacity-constrained. Capex investments to alleviate ...
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PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test
PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate ...
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