Boosted in part by growing card-issuer demand for chip cards that support both contact and contactless payments, card manufacturer CPI Card Group Inc. on Thursday reported a 32% first-quarter increase ...

As the payments industry reeled Monday morning during yet another wild session on Wall Street, card manufacturer CPI Card Group Inc. provided a glimmer of hopeful news when it reported improving ...

SOMERSET, N.J.--(BUSINESS WIRE)--CompoSecure, L.L.C., a pioneer and global leader in the design and manufacturing of premium financial cards, today announced that it has produced more than one million ...

PARIS — Smart cards featuring two interfaces, with and without contacts, will get a big boost today when Visa International puts its stamp of approval on a dual-interface controller chip developed by ...

Inside Contactless is developing chips for a dual contact/contactless card that Canada's Interac Association plans to use to capture more of the cash consumers spend on small-ticket purchases, Allen ...

using the MULTOS Operating System and PayPass. CPI developed a unique method that allows superb reading distance and the greatest durability in the market for third and fourth line embossing card ...

SOMERSET, N.J.--(BUSINESS WIRE)--CompoSecure, L.L.C. ("CompoSecure"), a pioneer and category leader in premium financial cards, today announced the company was awarded two U.S. Patents (No. 10762412B2 ...

Credit card payment methods have evolved dramatically over the years, from manual credit card imprinters to magnetic strip cards to cards with a computer chip that are inserted in a reader device. Get ...

Market players to witness increasing sales of SIM cards due to progressions in the telecommunications sector. ROCKVILLE, MD / ACCCESSWIRE / September 21, 2020 / The global dual interface smart card ...

CardLogix has a new line of dual interface smart cards targeted at the secure ID and government ID markets. The cards will be available with either Multos or Java OS. Though the CREDENTSYS cards are ...

Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...