(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

SK Hynix Inc, a key supplier to Nvidia and one of the worlds largest memory chipmakers, announced plans to invest 19 trillion ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

TSMC leads AI chip manufacturing with record 2024 results and 2nm/CoWoS growth. See why I rate the TSM stock a Buy.

3D packaging is rapidly transforming the semiconductor industry. 3D semiconductor packaging is a sophisticated packaging alternative for semiconductor chips that involve staking of atleast two or more ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...