Currently, TMO enables transparent memory offloading across millions of servers in our datacenters, resulting in memory savings of 20%–32%. Of this, 7%–19% is from the application containers, while ...

Featuring a 32-die stack of 2 terabit (Tb) (3) BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next ...

Featuring a 32-die stack of 2 terabit (Tb) 3 BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the ...

TOKYO, August 06, 2025--Kioxia Corporation today announced that its LC9 Series 245.76 TB SSD has received the FMS ‘Best of Show’ award in the ‘SSD Technology’ category.

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI.

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface ...

But even with all these advances, the fundamental challenge remains. The memory wall doesn’t go away. Compute-in-memory arrays still need to source their data from somewhere, and the amount of memory ...

HBM memory is so much better than using regular DRAM and bests GDDR as well for compute engines where bandwidth is the issue, but even with Micron Technology joining the HBM party with SK Hynix and ...

SK hynix unveils the industry's first 16-Hi HBM3E memory, offering up to 48GB per stack for AI GPUs with even more AI memory in the future.