Ceva today announced the appointment of Amir Faintuch, a seasoned technology executive, to its Board of Directors as an ...

Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.

This office represents a key milestone for Mixel as its first in Asia. It will enable Mixel to expand its engineering talent, ...

PIX, the pioneering provider of lightweight compression solutions, is thrilled to continue its collaboration with Nextera ...

As the semiconductor industry pushes the boundaries of innovation, modern system-on-chip (SoC) designs are growing ...

The Cyber ​​Resilience Act (CRA) is a regulation introduced by the European Union to enhance the cybersecurity of digital products and services, with ...

Certus Semiconductor is pleased to announce that it has begun 2025 with the delivery of a radiation-hardened by design I/O ...

The JESD204 Standard has undergone several iterations since its initial release in April 2006, the Serdes capabilities and ...

PIX, a leading provider of innovative image compression technologies, and PlexusAV, a pioneer in IPMX solutions, are proud to ...

SoC designers face rapid expansion in architecture, time-to-market pressures, scarcity of expertise, suboptimal utilization ...

Siemens’ longstanding and deep engagement with the RISC-V community dates back to the foundation’s early days. Involved ...

VeriSilicon (688521.SH) today announced the joint launch of the second-generation Yunbao series 5G RedCap/4G LTE dual-mode ...